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Welcome to ASE Tech Forum 2005
As a result of growing customer needs for smaller, more powerful ICs, the semiconductor packaging and test business is advancing at a tremendous pace. However, along with the growth of complex package technologies such as the ball grid array, chip scale and flip chip packages, come significant challenges. For the last twenty years, ASE has built itself up as a leader in the innovation of packaging and test processes, consistently providing customers with the right technologies and solutions that aim to counteract these challenges.
ASE is committed to maximizing next generation chip solutions while minimizing the burden on our customers’ resource allocations, and has made heavy investment in technology and equipment to ensure this reality. As the market leader, we strive to provide customers with competitively-priced technologies and quality manufacturing services to enable leading edge products.
ASE Tech Forum 2005* provides a platform for ASE to share views on the industry landscape, provide updates of our technology roadmaps, and present information on the advances in packaging and test technologies which solve customers’ electrical and thermal issues and enhance performance.
Please register to be notified of any upcoming ASE Tech Forums.
* The ASE Tech Forum is an ASE customer event. Registration is open to bona fide companies and partners only.
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